JPH032652U - - Google Patents
Info
- Publication number
- JPH032652U JPH032652U JP1989061963U JP6196389U JPH032652U JP H032652 U JPH032652 U JP H032652U JP 1989061963 U JP1989061963 U JP 1989061963U JP 6196389 U JP6196389 U JP 6196389U JP H032652 U JPH032652 U JP H032652U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- cold air
- nozzle
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989061963U JPH0727638Y2 (ja) | 1989-05-30 | 1989-05-30 | 集積回路素子の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989061963U JPH0727638Y2 (ja) | 1989-05-30 | 1989-05-30 | 集積回路素子の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH032652U true JPH032652U (en]) | 1991-01-11 |
| JPH0727638Y2 JPH0727638Y2 (ja) | 1995-06-21 |
Family
ID=31590687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989061963U Expired - Lifetime JPH0727638Y2 (ja) | 1989-05-30 | 1989-05-30 | 集積回路素子の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727638Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011119395A (ja) * | 2009-12-02 | 2011-06-16 | Fujitsu Telecom Networks Ltd | 電子部品の冷却構造 |
-
1989
- 1989-05-30 JP JP1989061963U patent/JPH0727638Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011119395A (ja) * | 2009-12-02 | 2011-06-16 | Fujitsu Telecom Networks Ltd | 電子部品の冷却構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727638Y2 (ja) | 1995-06-21 |
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